Multilayer ceramic electronic component and board having the same

ABSTRACT

A multilayer ceramic electronic component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body. The capacitance forming part includes first and second internal electrodes, first floating electrodes, and second floating electrodes. The ceramic body further includes a protective part having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed and a third dummy electrode is disposed between the first and second dummy electrodes.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2015-0022130 filed on Feb. 13, 2015, with the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

TECHNICAL FIELD

The present disclosure relates to a multilayer ceramic electroniccomponent and a board having the same.

BACKGROUND

As electronic products have been miniaturized, slim, andmulti-functionalized, miniaturization of electronic components has beenrequired, and electronic components mounted therein have been highlyintegrated. In accordance with this trend, spaces between the mountedelectronic components have decreased significantly.

A multilayer ceramic capacitor is mounted on circuit boards of severalelectronic products such as display devices such as liquid crystaldisplays (LCDs), plasma display panels (PDPs), or the like, computers,personal digital assistants (PDAs), mobile phones, and the like, toserve to charge or discharge electricity therein or therefrom.

This multilayer ceramic capacitor (MLCC) may be used as a component invarious electronic devices due to advantages such as a small size, highcapacitance, and ease of mounting.

In a multilayer ceramic capacitor having high voltage and lowcapacitance characteristics, an internal electrode structure designusing floating electrodes has frequently been used in order to implementsuch characteristics.

However, in the multilayer ceramic capacitor having high voltage and lowcapacitance characteristics, a reduced number of stacked internalelectrodes may cause difficulty in securing bending strength.

SUMMARY

An aspect of the present disclosure may provide a multilayer ceramicelectronic component capable of securing bending strength while havinghigh capacitance by including a capacitance forming part having floatingelectrodes and a protective part having dummy electrodes, particularly,floating electrodes and dummy electrodes formed in the center of aceramic body in a length direction.

According to an aspect of the present disclosure, a multilayer ceramicelectronic component may include a ceramic body including a capacitanceforming part in which a plurality of first and second dielectric layersare alternately stacked in a thickness direction of the ceramic body andexternal electrodes are disposed on opposite end surfaces of the ceramicbody in a length direction of the ceramic body. The capacitance formingpart may include first and second internal electrodes disposed spacedapart from each other on the plurality of first dielectric layers andexposed to the opposite end surfaces of the ceramic body, respectively,to thereby connect to the external electrodes. First floating electrodesare disposed spaced apart from the first and second internal electrodeson the plurality of first dielectric layers, and second floatingelectrodes are disposed on the plurality of second dielectric layers andpartially overlapping the first and second internal electrodes in thethickness direction. The ceramic body further includes a protective partdisposed between at least one of upper and lower surfaces of the ceramicbody in the thickness direction and the capacitance forming part andhaving a plurality of third dielectric layers on which first and seconddummy electrodes respectively exposed to the opposite end surfaces ofthe ceramic body are disposed and a third dummy electrode is disposedbetween the first and second dummy electrodes.

According to another aspect of the present disclosure, a board having amultilayer ceramic electronic component may include: a printed circuitboard on which first and second electrode pads are provided; and themultilayer ceramic electronic component as described above, mounted onthe printed circuit board.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings.

FIG. 1 is a perspective view of a multilayer ceramic electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 2 is a cross-sectional view of the multilayer ceramic electroniccomponent taken along line A-A′ of FIG. 1.

FIG. 3 is a perspective view of a board in which the multilayer ceramicelectronic component of FIG. 1 is mounted on a printed circuit board.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

The disclosure may, however, be embodied in many different forms andshould not be construed as being limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of thedisclosure to those skilled in the art.

In the drawings, the shapes and dimensions of elements may beexaggerated for clarity, and the same reference numerals will be usedthroughout to designate the same or like elements.

Meanwhile, in general, an example of a multilayer ceramic electroniccomponent may include a multilayer ceramic capacitor, an inductor, apiezoelectric element, a varistor, a thermister, or the like. Themultilayer ceramic capacitor will be described by way of an exemplaryembodiment. However, the multilayer ceramic electronic componentaccording to the exemplary embodiment is not limited to the multilayerceramic capacitor.

FIG. 1 is a perspective view of a multilayer ceramic electroniccomponent according to an exemplary embodiment.

FIG. 2 is a cross-sectional view of the multilayer ceramic electroniccomponent taken along line A-A′ of FIG. 1.

Referring to FIGS. 1 and 2, the multilayer ceramic electronic component100, according to the exemplary embodiment, may include a ceramic body110 and external electrodes 131 and 132.

The ceramic body 110 may be formed by stacking a plurality of dielectriclayers 111 (111 a, 111 b, and 111 c) in a thickness direction of theceramic body 110 and then sintering the stacked dielectric layers 111.Adjacent dielectric layers may be integrated so that boundariestherebetween are not readily apparent without a scanning electronmicroscope (SEM).

Here, the ceramic body 110 may have a hexahedral shape.

Directions of the ceramic body 110 will be defined in order to clearlydescribe the exemplary embodiment. “L,” “W,” and “T” illustrated in FIG.1 refer to a length direction, a width direction, and a thicknessdirection, respectively. Further, the ceramic body 110 may have a lowersurface provided as a mounting surface, an upper surface opposing thelower surface, opposite end surfaces in the length direction, andopposite side surfaces in the width direction.

Referring to FIG. 2, the ceramic body 110 may include a capacitanceforming part 114 formed by alternately disposing a plurality of firstand second dielectric layers 111 a and 111 b.

Further, the ceramic body 110 may include a protective part disposedbetween at least one of the upper and lower surfaces of the ceramic body110 and the capacitance forming part 114 and including a plurality ofthird dielectric layers 111 c.

In this case, the number of protective parts and a thickness of theprotective part in the thickness direction of the ceramic body 110 arenot limited to those illustrated in FIG. 2.

Hereinafter, a protective part disposed between the upper surface of theceramic body 110 and the capacitance forming part 114 will be defined asa first protective part 112, and a protective part disposed between thelower surface of the ceramic body 110 and the capacitance forming part114 will be defined as a second protective part 113.

The first to third dielectric layers 111 a, 111 b, and 111 c may beformed of a dielectric material and may improve capacitance of thecapacitor.

Further, the first to third dielectric layers 111 a, 111 b, and 111 cmay contain a ceramic material having high permittivity, such as abarium titanate (BaTiO₃) based ceramic powder, but a material of thefirst to third dielectric layers 111 a, 111 b, and 111 c is not limitedthereto as long as sufficient capacitance may be obtained.

In addition, the first to third dielectric layers 111 a, 111 b, and 111c may further contain various ceramic additives such as transition metaloxides or carbides, a rare earth element, magnesium (Mg), aluminum (Al),or the like, an organic solvent, a plasticizer, a binder, a dispersant,and the like, in addition to the ceramic powder, as needed.

The capacitance forming part 114 may be formed by alternately disposingthe plurality of first and second dielectric layers 111 a and 111 b.

Referring to FIG. 2, first and second internal electrodes 121 and 122may be disposed on the plurality of first dielectric layers 111 a to beexposed to opposite end surfaces of the ceramic body 110 in the lengthdirection, respectively.

The first and second internal electrodes 121 and 122 may be electrodeshaving different polarities from each other, and may be disposed to bespaced apart from each other on the same first dielectric layer 111 a.

Meanwhile, the capacitance forming part 114 may further include firstfloating electrodes 123 disposed between the first and second internalelectrodes 121 and 122 on the plurality of first dielectric layers 111 ato be spaced apart from the first and second internal electrodes 121 and122 in the length direction.

The first floating electrode 123 may be positioned in a central portionin a cross-section of the ceramic body 110 in a length-thicknessdirection.

Further, the first floating electrode 123 may be disposed to be spacedapart from each of the first and second internal electrodes 121 and 122by a predetermined distance in the length direction.

However, the disposition of the first floating electrode 123 is notlimited to that illustrated in FIG. 2, and distances in the lengthdirection between the first floating electrode 123 and the firstinternal electrode 121 and between the first floating electrode 123 andthe second internal electrode 122 are not necessarily equal to eachother.

The first and second internal electrodes 121 and 122 and the firstfloating electrode 123 may be formed of a conductive metal, such assilver (Ag), lead (Pb), platinum (Pt), nickel (Ni), copper (Cu), andalloys thereof. However, a material of the first and second internalelectrodes 121 and 122 and the first floating electrode 123 is notlimited thereto.

The first and second internal electrodes 121 and 122 and the firstfloating electrode 123 may have a rectangular shape in the length-widthdirection, but the shapes of the first and second internal electrodes121 and 122 and the first floating electrode 123 are not limitedthereto. In addition, lengths of the first and second internalelectrodes 121 and 122 and the first floating electrode 123 are notlimited to those illustrated in FIG. 2.

The first floating electrode 123 may be disposed in the central portionof the ceramic body 110 in the length direction to thereby be spacedapart from the first and second internal electrodes 121 and 122 by thepredetermined distance in the length direction.

Meanwhile, second floating electrodes 124 may be formed on the pluralityof second dielectric layers 111 b to partially overlap the first andsecond internal electrodes 121 and 122 in the thickness direction.

In detail, the second floating electrode 124 may be formed in theceramic body 110 so as not to be exposed outside of the ceramic body110, and a length of the second floating electrode 124 may be the sameas that of the third dummy electrode 143. A description thereof will beprovided below.

Meanwhile, the second floating electrode 124 may serve to decreasevoltage applied to the first and second internal electrodes 121 and 122.Therefore, withstand voltage characteristics may be improved, and thenumber of stacked first and second internal electrodes 121 and 122 maybe increased as long as insulation is not broken.

Further, capacitance may also be formed in portions of the capacitanceforming part 114 in which the second floating electrode 124 and thefirst and second internal electrodes 121 and 122 and the first floatingelectrode 123 overlap each other.

In view of an equivalent circuit, it may be considered that twocapacitors are connected to each other in series, and thus the voltageapplied to the first and second internal electrodes 121 and 122 may bedecreased by half.

The first and second protective parts 112 and 113 may be formed bystacking the plurality of third dielectric layers 111 c.

In this case, first and second dummy electrodes 141 and 142 may bedisposed on the plurality of third dielectric layers 111 c.

Further, the first and second protective parts 112 and 113 may furtherinclude third dummy electrodes 143 disposed between the first and seconddummy electrodes 141 and 142 on the plurality of third dielectric layers111 c.

The first and second protective parts 112 and 113 may be formed by atleast two third dielectric layers 111 c on which the first to thirddummy electrodes 141 to 143 are disposed in the thickness direction ofthe ceramic body 110.

The first to third dummy electrodes 141 to 143 may be formed in the samedirection as that of the first and second internal electrodes 121 and122.

Further, the first to third dummy electrodes 141 to 143 may notcontribute to forming capacitance except for parasitic capacitancegenerated by effects of the external electrodes 131 and 132 disposed onopposite end surfaces of the ceramic body 110 in the length direction orthe capacitance forming part 114.

In particular, the third dummy electrode 143 may be disposed on thethird dielectric layer 111 c spaced apart from the first and seconddummy electrodes 141 and 142 by a predetermined distance in the lengthdirection, and may be formed to be positioned in the central portion ofthe cross section of the ceramic body 110 in the length-thicknessdirection.

The third dummy electrode 143 may be disposed in the center of theceramic body 110 in the length direction, and thus bending strength maybe increased.

Therefore, a decrease in strength caused by a step problem that mayoccur due to the stacking of dummy electrodes disposed in order toincrease bending strength of a multilayer ceramic capacitor with thesmall number of stacked internal electrodes may be prevented.

The third dummy electrode 143 may be in a position corresponding to thesecond floating electrode 124. That is, the third dummy electrode 142and the second floating electrode 124 may overlap each other in thethickness direction.

The third dummy electrode 143 and second floating electrode 124 may bepositioned in the center of the ceramic body 110 in the lengthdirection, and thus the decrease in strength caused by the step problemthat may occur due to the stacking of the dummy electrodes may beprevented.

Meanwhile, a plurality of fourth and fifth dummy electrodes 144 and 145may be disposed in the capacitance forming part 114.

The capacitance forming part 114 may further include the fourth andfifth dummy electrodes 144 and 145 disposed on the plurality of seconddielectric layers 111 b.

The fourth and fifth dummy electrodes 144 and 145 may be exposed toopposite end surfaces of the ceramic body 110 in the length direction,respectively, on the plurality of second dielectric layers 111 b onwhich the second floating electrode 124 is formed, thereby beingelectrically connected to the external electrodes 131 and 132.

The fourth and fifth dummy electrodes 144 and 145 may be formed tooverlap the first and second internal electrodes 121 and 122 in thethickness direction, respectively, and the second floating electrode 124may be disposed between the fourth and fifth dummy electrodes 144 and145 spaced apart from the fourth and fifth dummy electrodes 144 and 145by a predetermined distance in the length direction.

The second floating electrodes 124 and the fourth and fifth dummyelectrodes 144 and 145 may have a rectangular shape in the length-widthdirection, but the shapes of the second floating electrodes 124 and thefourth and fifth dummy electrodes 144 and 145 are not limited thereto.

Further, lengths of the second floating electrodes 124 and the fourthand fifth dummy electrodes 144 and 145 are not limited to thoseillustrated in FIG. 2.

However, the second floating electrode 124 may be sufficiently elongatedin the length direction of the ceramic body 110 so that the secondfloating electrode 124 may partially overlap the first and secondinternal electrodes 121 and 122 in the thickness direction,respectively.

The fourth and fifth dummy electrodes 144 and 145 as described above maydecrease vibrations generated in the external electrodes 131 and 132disposed on opposite end surfaces of the ceramic body 110 in the lengthdirection and decrease acoustic noise.

The external electrodes 131 and 132 may include first and secondexternal electrodes 131 and 132 disposed on opposite end surfaces of theceramic body 110 in the length direction.

The first and second external electrodes 131 and 132 may be electricallyconnected to the first and second internal electrodes 121 and 122,respectively.

The first and second external electrodes 131 and 132 as described abovemay be formed of a conductive metal, such as silver (Ag), lead (Pb),platinum (Pt), nickel (Ni), copper (Cu), and alloys thereof, but amaterial of the first and second external electrodes 131 and 132 is notlimited thereto.

The first and second external electrodes 131 and 132 may extend fromopposite end surfaces of the ceramic body 110 in the length direction toat least one of the upper and lower surfaces of the ceramic body 110 andopposite side surfaces thereof in the width direction.

That is, the first and second external electrodes 131 and 132 may bedistinguished into portions 131 a and 132 a disposed on both endsurfaces of the ceramic body 110 in the length direction and portions131 b and 132 b extending to be disposed on at least one of the upperand lower surfaces of the ceramic body 110 and opposite side surfacesthereof in the width direction.

Meanwhile, plating layers (not illustrated) may be formed on the firstand second external electrodes 131 and 132, as needed.

The plating layers may include nickel (Ni) plating layers formed on thefirst and second external electrodes 131 and 132 and tin (Sn) platinglayers formed on the nickel plating layers.

The first and second plating layers as described above may increaseadhesive strength between the multilayer ceramic electronic componentand a printed circuit board when the multilayer ceramic electroniccomponent is mounted on the printed circuit board by solder, or thelike. The plating may be performed by a method known in the art, such asa lead-free plating method, but a plating method is not limited thereto.

An interval between the third dummy electrodes 143 in the thicknessdirection of the ceramic body 110 may be narrower than an intervalbetween the first and second floating electrodes 123 and 124 in thethickness direction of the ceramic body 110.

In more detail, when the interval between the third dummy electrodes 143in the thickness direction of the ceramic body 110 is defined as T1, andthe interval between the first and second floating electrodes 123 and124 in the thickness direction of the ceramic body 110 is defined as T2,0.01×T2

T1

0.5×T2 may be satisfied.

Bending strength of the multilayer ceramic capacitor even with the smallnumber of stacked internal electrodes may be increased by adjusting theinterval T1 between the third dummy electrodes 143 in the thicknessdirection of the ceramic body 110 and the interval T2 between the firstand second floating electrodes 123 and 124 in the thickness direction ofthe ceramic body to satisfy 0.01×T2

T1

0.5×T2.

According to the exemplary embodiment, a thickness Tc of the protectivepart disposed between at least one of the upper and lower surfaces ofthe ceramic body 110 and the capacitance forming part 114 and athickness Td of a region of the protective part in which the first andsecond dummy electrodes 141 and 142 are disposed may satisfy0.1×Tc≦Td<0.99×Tc.

The bending strength of the multilayer ceramic capacitor with the smallnumber of stacked internal electrodes may be improved and adhesivestrength between the internal electrodes and the external electrodes maybe improved by adjusting the thickness Tc of the protective partdisposed between at least one of the upper and lower surfaces of theceramic body 110 and the capacitance forming part 114 and the thicknessTd of the region of the protective part in which the first and seconddummy electrodes 141 and 142 are disposed to satisfy 0.1×Tc≦Td

0.99×Tc.

When the thickness Td of the region of the protective part in which thefirst and second dummy electrodes 141 and 142 are is less than 0.1×Tc,the bending strength of the multilayer ceramic capacitor and adhesivestrength between the internal electrodes and the external electrodes maynot be improved.

Conversely, when the thickness Td of the region of the protective partin which the first and second dummy electrodes 141 and 142 are is morethan 0.99×Tc, reliability of the multilayer ceramic capacitor may bedeteriorated due to a moisture resistance defect, or the like.

According to the exemplary embodiment, a length Lp of the third dummyelectrode 143 in the length direction of the ceramic body 110, aninterval Lc′ in the length direction between the external electrodes 131b and 132 b extending on at least one of the upper and lower surfaces ofthe ceramic body 110, and a length Lc of the ceramic body 110 in thelength direction may satisfy 1.1×Lc′≦Lp

0.95×Lc.

That is, the length Lp of the third dummy electrode 143 in the lengthdirection of the ceramic body 110 may be longer than the interval Lc′ inthe length direction between the external electrodes 131 b and 132 bextending on at least one of the upper and lower surfaces of the ceramicbody 110.

Further, the length Lp of the third dummy electrodes 143 in the lengthdirection of the ceramic body 110 may be shorter than the length Lc ofthe ceramic body 110 in the length direction.

The bending strength of the multilayer ceramic capacitor with the smallnumber of stacked internal electrodes may be improved by adjusting thelength Lp of the third dummy electrodes 143 in the length direction ofthe ceramic body 110, the interval Lc′ in the length direction betweenthe external electrodes 131 b and 132 b extending on at least one of theupper and lower surfaces of the ceramic body 110, and the length Lc ofthe ceramic body 110 in the length direction to satisfy 1.1×Lc′≦Lp

0.95×Lc.

According to the exemplary embodiment, an interval Lm between the thirddummy electrode 143 and one end surface of the ceramic body 110 in thelength direction and a length Lb from one end surface of the ceramicbody 110 in the length direction to an edge of the external electrode131 b or 132 b extending on at least one of the upper and lower surfacesof the ceramic body 110 may satisfy Lm≦0.95×Lb.

That is, the third dummy electrode 143 may be disposed in the center ofthe ceramic body 110 in the length direction, but opposite ends thereofmay be disposed closer to opposite end surfaces of the ceramic body 110as compared with the edge of the external electrode 131 b or 132 bextending on at least one of the upper and lower surfaces of the ceramicbody 110. The third dummy electrode 143 may overlap both the first andsecond external electrodes 131 and 132 in the thickness direction.

At the same time, opposite ends of the third dummy electrode 143 may bedisposed to be spaced apart from the first and second dummy electrodes141 and 142 by a predetermined distance in the length direction.

The bending strength of the multilayer ceramic capacitor with the smallnumber of stacked internal electrodes may be improved by adjusting theinterval Lm between the third dummy electrode 143 and one end surface ofthe ceramic body 110 in the length direction and the length Lb from oneend surface of the ceramic body 110 in the length direction to the edgeof the external electrode 131 b or 132 b extending on at least one ofthe upper and lower surfaces of the ceramic body 110 to satisfyLm≦0.95×Lb.

Meanwhile, a length Lp′ of at least one of the first and second internalelectrodes 121 and 122 in the length direction of the ceramic body 110and the length Lb from one end surface of the ceramic body 110 in thelength direction to the edge of the external electrode 131 b or 132 bextending on at least one of the upper and lower surfaces of the ceramicbody 110 may satisfy 1.1×Lb≦Lp′.

The bending strength of the multilayer ceramic capacitor with the smallnumber of stacked internal electrodes may be improved by adjusting thelength Lp′ of at least one of the first and second internal electrodes121 and 122 in the length direction of the ceramic body 110 and thelength Lb from one end surface of the ceramic body 110 in the lengthdirection to the edge of the external electrode 131 b or 132 b extendingon at least one of the upper and lower surfaces of the ceramic body tosatisfy 1.1×Lb≦Lp′.

Further, a difference Lm−Ld between the interval Lm between the thirddummy electrode 143 and one end surface of the ceramic body 110 in thelength direction and a length Ld of at least one of the first and seconddummy electrodes 141 and 142 in the length direction of the ceramic body110, and the length Lc of the ceramic body 110 in the length directionmay satisfy 0.01×Lc

Lm−Ld.

The bending strength of the multilayer ceramic capacitor with the smallnumber of stacked internal electrodes may be improved by adjusting thedifference Lm-Ld between the interval Lm between the third dummyelectrode 143 and one end surface of the ceramic body 110 in the lengthdirection and the length Ld of at least one of the first and seconddummy electrodes 141 and 142 in the length direction of the ceramic body110, and the length Lc of the ceramic body 110 in the length directionto satisfy 0.01×Lc

Lm−Ld.

Board Having Multilayer Ceramic Electronic Component

FIG. 3 is a perspective view of a board in which the multilayer ceramicelectronic component of FIG. 1 is mounted on a printed circuit board.

Referring to FIG. 3, a board 200 having a multilayer ceramic electroniccomponent 100, according to the present exemplary embodiment, mayinclude a printed circuit board 210 on which the multilayer ceramicelectronic component 100 is mounted and first and second electrode pads221 and 222 formed on the printed circuit board 210 to be spaced apartfrom each other.

In this case, the multilayer ceramic electronic component 100 may beelectrically connected to the printed circuit board 210 by solders 230in a state in which first and second external electrodes 131 and 132 arepositioned to contact the first and second electrode pads 221 and 222,respectively.

Except for the description above, a description of features overlappingthose of the multilayer ceramic capacitor according to the previousembodiment describe above will be omitted.

As set forth above, according to exemplary embodiments, the multilayerceramic electronic component may include the capacitance forming parthaving the floating electrodes and the protective part having the dummyelectrodes, whereby the bending strength of the multilayer ceramicelectronic component may be improved.

Further, according to exemplary embodiments, the capacitance formingpart and the protective part may include the dummy electrodes, andadhesive strength between the internal electrodes and the externalelectrodes may be improved.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A multilayer ceramic electronic componentcomprising: a ceramic body including a capacitance forming part in whicha plurality of first and second dielectric layers are alternatelystacked in a thickness direction of the ceramic body; and externalelectrodes disposed on opposite end surfaces of the ceramic body in alength direction of the ceramic body, wherein the capacitance formingpart includes: first and second internal electrodes disposed spacedapart from each other on the plurality of first dielectric layers, andexposed to the opposite end surfaces of the ceramic body, respectively,to thereby connect to the external electrodes; first floating electrodesdisposed spaced apart from the first and second internal electrodes onthe plurality of first dielectric layers; and second floating electrodesdisposed on the plurality of second dielectric layers and partiallyoverlapping the first and second internal electrodes in the thicknessdirection, and the ceramic body further includes a protective partdisposed between at least one of upper and lower surfaces of the ceramicbody in the thickness direction and the capacitance forming part andhaving a plurality of third dielectric layers on which first and seconddummy electrodes respectively exposed to the opposite end surfaces ofthe ceramic body are disposed and a third dummy electrode is disposedbetween the first and second dummy electrodes.
 2. The multilayer ceramicelectronic component of claim 1, wherein the third dummy electrode ispositioned in a central portion of the ceramic body in the lengthdirection and disposed spaced apart from the first and second dummyelectrodes.
 3. The multilayer ceramic electronic component of claim 1,wherein the third dummy electrode overlaps the second floating electrodein the thickness direction.
 4. The multilayer ceramic electroniccomponent of claim 1, wherein the capacitance forming part furtherincludes fourth and fifth dummy electrodes disposed on the plurality ofsecond dielectric layers and exposed to the opposite end surfaces of theceramic body, respectively, and the second floating electrode ispositioned in a central portion of the ceramic body in the lengthdirection and disposed spaced apart from the fourth and fifth dummyelectrodes.
 5. The multilayer ceramic electronic component of claim 1,wherein an interval between the third dummy electrodes in the thicknessdirection of the ceramic body is narrower than an interval between thefirst and second floating electrodes in the thickness direction of theceramic body.
 6. The multilayer ceramic electronic component of claim 1,wherein an interval T1 between the third dummy electrodes in thethickness direction of the ceramic body and an interval T2 between thefirst and second floating electrodes in the thickness direction of theceramic body satisfy 0.01×T2

T1

0.5×T2.
 7. The multilayer ceramic electronic component of claim 1,wherein a thickness Tc of the protective part disposed between at leastone of the upper and lower surfaces of the ceramic body and thecapacitance forming part and a thickness Td of a region of theprotective part in which the first and second dummy electrodes aredisposed satisfy 0.1×Tc≦Td

0.99×Tc.
 8. The multilayer ceramic electronic component of claim 1,wherein the external electrodes extend from the end surfaces of theceramic body to at least one of the upper and lower surfaces of theceramic body.
 9. The multilayer ceramic electronic component of claim 8,wherein a length Lp of the third dummy electrode in the length directionof the ceramic body, an interval Lc′ between the external electrodesextending on at least one of the upper and lower surfaces of the ceramicbody, and a length Lc of the ceramic body in the length directionsatisfy 1.1×Lc′≦Lp

0.95×Lc.
 10. The multilayer ceramic electronic component of claim 8,wherein an interval Lm between the third dummy electrode and one endsurface of the ceramic body in the length direction and a length Lb inthe length direction from one end surface of the ceramic body to an edgeof the external electrode extending on at least one of the upper andlower surfaces of the ceramic body satisfy Lm≦0.95×Lb.
 11. Themultilayer ceramic electronic component of claim 8, wherein a length Lp′of at least one of the first and second internal electrodes in thelength direction of the ceramic body and a length Lb in the lengthdirection from one end surface of the ceramic body to an edge of theexternal electrode extending on at least one of the upper and lowersurfaces of the ceramic body satisfy 1.1×Lb≦Lp′.
 12. The multilayerceramic electronic component of claim 1, wherein a difference Lm−Ldbetween an interval Lm in the length direction between the third dummyelectrode and one end surface of the ceramic body and a length Ld of atleast one of the first and second dummy electrodes in the lengthdirection of the ceramic body, and a length Lc of the ceramic body inthe length direction satisfy 0.01×Lc

Lm−Ld.
 13. A board having a multilayer ceramic electronic componentcomprising: a printed circuit board on which first and second electrodepads are provided; and the multilayer ceramic electronic component ofclaim 1, mounted on the printed circuit board.